The semiconductor packaging new material (Lanzhou) production line project, a joint investment by Jinchuan Group Co., Ltd. and Lanxin Energy Technology Co., Ltd., was launched on Sept 6.
The opening ceremony of the semiconductor packaging new material (Lanzhou) production line project [Photo/jnmc.com]
With a total investment of 998 million yuan (about $150 million), this project will become one of the largest suppliers of semiconductor packaging materials in Gansu.
To strengthen the strategic layout in the semiconductor industry chain, Jinchuan Niedu Industrial Co., Ltd. and Lanxin Energy Technology jointly established the Gansu Jinchuan Lanxin Electronic Technology Co., Ltd., a high-tech enterprise in the semiconductor industry, to build this project so as to meet the internal needs of chain extension and scale expansion in the non-ferrous processing industry.
The opening ceremony of the semiconductor packaging new material (Lanzhou) production line project [Photo/jnmc.com]
Phase I of this project covers an area of 130 mu, with an investment of 400 million yuan. The building includes a main plant, power station and sewage treatment station etc. It is worth mentioning that the lead frame, as the carrier of the integrated circuit chip, is the key component of the chip package, which makes the lead end of the internal circuit of the chip connect with the external lead.
As the pioneer of Gansu non-ferrous chemical industry chain, this project is the first production plant of Jinchuan Group in Lanzhou New Area, as well as a key new material industry project for the company.
The person in charge of Gansu Jinchuan Lanxin Electronic Technology said the project is planned to be completed in September 2024. It is projected to achieve an annual sale of 600 million yuan and provide more than 300 jobs.
