New plant of Tongfu Microelectronics begins operations
A ceremony marking the start of the second phase of the manufacturing plant of Tongfu Microelectronics Co is held at the Su-Xi-Tong Science and Technology Park in Nantong on Aug 9. [Photo/ntfabu.com]
The second phase of the manufacturing plant of Tongfu Microelectronics Co kicked off at the Su-Xi-Tong Science and Technology Park in Nantong, East China's Jiangsu province on Aug 9.
The project, which covers a floor area of 53,800 square meters, including 35,000 sq m for production, started construction on July 1, 2018.
The plant features high-end integrated circuit package technologies such as FCBGA, FCCSP and FCLGA. Its products will be widely used in new infrastructure industries, including consumer electronics, internet of things, internet of vehicles and 5G.
When operating at full capacity, the plant is able to achieve a monthly output with a value of 60 million yuan ($8.69 million) and an annual sales revenue of 600 million yuan.
The sales revenue of Tongfu Microelectronics in 2019 grew more than 10 percent year-on-year in 2019.
According to Shi Lei, the president of Tongfu Microelectronics Co, the company's overall sales revenue for this year is expected to surpass 10 billion yuan. Shi also expects the sales revenue for the plant in Su-Xi-Tong Park to grow by more than 80 percent year-on-year.
According to Shi, the plant is not only a strategic step in the company's expansion, but also a result of the park's efforts to promote the development of the IC and intelligent equipment manufacturing industry.
Wang Kai, secretary of the park's Party working committee, said that the local administration has been working to realize the goal of attracting three projects that are each worth 10 billion yuan or more, 35 1-billion-yuan projects and 95 100-million-yuan projects as part of efforts to become a model for cross-river development in the Yangtze River Delta region.