A rendering of Hefei Integrated Circuit Testing Industry Base. [Photo/WeChat ID: hefeigaoxinfabu]

Construction of the Hefei Integrated Circuit Testing Industry Base has officially begun on March 21 and is expected to be completed by May 2023.

The project is being built for Hefei Huayu Semiconductor Co and is located at the northeast corner of Xuetian Road and Ningxi Road in Hefei National High-tech Industry Development Zone.

It will cover an area of about 2.73 hectares and have a total floor area of about 50,000 square meters. It will include production workshops, assembly workshops and support facilities.

After the project is completed and put into production, the Hefei Integrated Circuit Testing Industry Base will provide testing services for 8-inch and 12-inch wafers and chip products of various specs like SOP, TSSOP, QFN, BGA and SIP. It will be able to test 90,000 8-inch and 12-inch wafers and 100 million pieces of high-end integrated circuit chips per month.

The large testing capacity will help meet the high-volume needs for local integrated circuit R&D and mass production, and further promote the development of Hefei's integrated circuit industrial chain in terms of pre-package wafer testing and post-package finished product testing.