A rendering of the IC headquarters base. [Photo/WeChat account: hefeigaoxinfabu]

The integrated circuits (IC) headquarters base, the Phase II project of the IC industrial park in the Hefei National High-tech Industry Development Zone, is currently under construction.

The project is expected to be completed in October, 2022, with a total construction area of 334,000 square meters and a total investment of 1.8 billion yuan ($263.68 million).

It is located at the intersection of the zone's Changning Avenue and Baiyanwan Road and will include a headquarters building, standardized factory buildings, public service platforms and incubators.

After completion, it will strive to attract enterprises engaged in the design and development, packaging and testing of IC chips and sensors to set up offices.

The Phase I project of the IC industrial park is near completion, and a number of IC-related enterprises such as Hefei Ruihe Technology, Gengol, and Shengda Technology have already signed contracts to set up operations in the area.