Guangzhou Daily: Huangpu conference highlights electronic materials

The 2020 Conference on the Technological Development for the Chinese Electronic Materials Industry is held in Huangpu on Dec 4 and 5.

The 2020 Conference on the Technological Development for the Chinese Electronic Materials Industry was held in Guangzhou's Huangpu district on Dec 4 and 5.

About 500 domestic and foreign experts, as well as entrepreneurs attended the event to discuss national policies, the current status, technological innovation, problems, and the development direction of the electronic materials industry. They also shared the latest technologies and applications related to the industry.

Tu Hailing, a member of the Chinese Academy of Engineering, Jiang Fengyi, a professor at Nanchang University, Yang Deren, a professor at Zhejiang University, Lung Chu, vice president of SEMI, and Zhao Zhengping, former deputy general manager of China Electronic Technology Group Corporation, delivered keynote speeches at the opening ceremony.

Seven parallel forums related to topics like advanced semiconductor materials, advanced manufacturing materials for integrated circuits, as well as 5G base materials and terminal electronic materials were held during the conference, which also included exhibitions, a matchmaking conference, and field investigations.

The conference was jointly organized by the China Electronics Materials Industry Association, the Fifth Electronics Research Institute of the Ministry of Industry and Information Technology, the Guangzhou industry and information technology bureau, as well as the Huangpu district people's government.

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