Founder commits to world's 1st intelligent PCB plant

Zhuhai Founder PCB Development Co plans to build the world's first intelligent printed circuit board (PCB) factory and carry out a new round of technological innovation for another State Scientific & Technological Progress Award (SSTPA). 

Industrial production at Zhuhai Founder PCB Development Co [Photo by Zhong Fan / Zhuhai Daily]

PCB is hailed as the "mother of electronic system products." It provides a key link in various electronic components to form the predetermining circuit. The domestic PCB industry shows explosive growth with the boom in electronics manufacturing.

Founder High-end Communications Intelligence Park has completed land acquisition and design bidding. Construction will begin in July and be finished by the end of next year. After equipment installation and commissioning, industrialization will be realized in early 2019.

CEO Hu Yongshuan disclosed that the second-phase to build the world’s first intelligent PCB plant is being stepped up. The new production center of global high-end communications, servers, and data storage PCB will realize unmanned operation upon production, with annual output per capita exceeding 1.5 million yuan ($218,000), triple that of the average in the industry.   

Established in Zhuhai in 1986, Zhuhai Founder PCB Development Co is a leading PCB manufacturer at home and abroad. Headquartered at Doumen Fushan Industrial Park, the company has a technology institute and six production facilities including one each in Chongqing and Hangzhou.

One of the China's top 100 electronics enterprises, the firm has total assets of 5 billion yuan ($726.4 million) with average annual growth rate of 62.4 percent and average sales growth of 57.1 percent. Its sales revenue last year reached 2.6 billion yuan ($377.7 million). Since 2009, the company has been ranked third domestically and 40th globally among enterprises in the industry by the China Printed Circuit Association (CPCA). It is now constructing a world-leading PCB production, research, and development base in smartphones, semiconductor packaging substrates, and high-end communication boards.