The Granular Epoxy Molding Compound for Fan-out Panel Level Packaging (type KHG900G-A) from Jiangsu Zhongke Kehua New Materials Co Ltd, or Scienchem, located in Taizhou's Hailing Industrial Park, passed the scientific and technological achievement appraisal organized by the China Electronics Materials Industry Association on Nov 25.
The KHG900G-A features a high glass transition temperature, low stress and low warping, boasting advanced performance among same products globally, as confirmed by the appraisal panel. The successful development of this key material has injected momentum into the high-quality development of China's semiconductor industry.
Established in 2011, Scienchem is a high-tech enterprise specializing in the R&D, production, and sale of semiconductor packaging materials for EMC products.
The company boasts eight EMC production lines capable of producing over 16,000 metric tons annually, catering to the demands of high-end EMC manufacturing.