Shanghai Zhenglong Xinchuang Microelectronics Co Ltd secured an industrial land plot in Nanxiang town's eastern industrial park in Jiading district for the company's HITS advanced packaging R&D and industrialization project.
The project focuses on developing high-speed interconnect technology solutions for high-end chiplet packaging, targeting key markets including AI servers, edge AI devices and high-end mobile terminals.
Jiading boasts a sound industrial ecosystem and a complete industrial chain for integrated circuits, laying a solid foundation for the project's development.
With a total investment of no less than 7.5 billion yuan ($1.12 billion), the project covers a construction area of over 55,000 square meters. Scheduled to run over 42 months, it is set for completion in February 2030.
It will deploy advanced global packaging and testing equipment to expand the wafer-level advanced packaging capacity to meet booming AI and high-performance computing market demands.
The project targets five core advanced packaging bottlenecks to optimize chip interconnection, data transmission, integration, sizing and heat dissipation. It marks the company's upgrading from display driver chip packaging to high-end AI computing chip packaging.