1st intelligent design automation summit kicks off
The opening ceremony of the first Intelligent Design Automation Summit (IDAS) is held in Optics Valley of China, Wuhan, Central China's Hubei province, on Sept 18. [Photo/WeChat account of Optics Valley of China]
On Sept 18, the first Intelligent Design Automation Summit (IDAS) was held in the East Lake High-tech Development Zone (also known as Optics Valley of China, or OVC), where the Optics Valley Multi-physics Field Electronic Design Automation (EDA) Open Innovation Center was unveiled.
The conference was organized by the Electronic Design Automation Abstraction (EDA²), with the support of the valley's management committee. It brought together nearly 1,000 industry experts from over 300 domestic and international integrated circuit (IC) universities, research institutes, and professional organizations, spanning areas such as digital design and manufacturing.
Academician Huang Ru, from the Chinese Academy of Sciences, attended the opening ceremony and delivered a speech. Yang Xudong, deputy head of the electronic information department at the Ministry of Industry and Information Technology, also addressed the meeting.
The Optics Valley Multi-physics Field Electronic Design Automation (EDA) Open Innovation Center is unveiled at the summit. [Photo/WeChat account of Optics Valley of China]
EDA, known as the "mother of chips", is the most fundamental core technology in the upstream IC industrial chain. It is also a crucial link in the IC ecosystem. The development level of EDA directly determines the IC industry's competitiveness.
China's EDA industry and research have made significant progress. By the end of 2022, there were more than 100 EDA vendors in China, with home-made EDA sales revenue accounting for more than 15 percent of the domestic market.
Optics Valley is currently home to over 200 IC enterprises, with a workforce of over 30,000 and industrial scale exceeding 40 billion yuan ($5.57 billion). It has formed a full-fledged industrial chain covering design, manufacturing, packaging, materials, and equipment.
