Xiangzhou District, Zhuhai

Goldpac Group Ltd will further expand the market of financial service outsourcing under the partnerships with CEC Huada Electronic Design and Unigroup Guoxin Microelectronics, domestic chip manufacturing giants, it was announced on June 9.

Goldpac signed agreements respectively with the two companies during the 2018 Global Service Outsourcing Summit (GSOS), held in Zhuhai from June 8 to 9, to carry out extensive cooperation in intelligent mobile payment, and the Internet of Things (IoT) among other fields. The project will be based in Zhuhai's Baojia Financial Technology Center.

The common goal of the parties is to establish a globally competitive exchange platform featuring fintech innovations.

A representative of CEC Huada Electronic Design (L) signs a cooperative agreement with that of Goldpac Group.

Goldpac is a global solution provider of intelligent financial services based in the Xiangzhou District of Zhuhai. The company now ranks first domestically and fourth globally in terms of its ability to provide payment solutions. 

Being the first company to introduce the concept of outsourcing financial card designs across the country, Goldpac has grown into China's largest supplier of financial cards and personalization services.

CEC Huada Electronic Design headquartered in Beijing is owned by China Electronics Corporation (CEC), which is a state-owned corporation and also a Fortune Global 500 company. The company has long enjoyed a leading place in supplying smart cards and security chips as well as providing total solutions.

The signing of the agreement takes place during the 2018 Global Service Outsourcing Summit (GSOS) held in Zhuhai from June 8 to 9. [Photos courtesy WeChat account of Goldpac]

Also headquartered in Beijing, Unigroup Guoxin Microelectronics, formerly Unigroup Guoxin, is engaged in the electronic components industry. It focuses on resonators, oscillators and capacitors.

According to a company manager, complementary resources will be utilized to overcome the difficulties in industrial development, upgrade their businesses and integrate the high-, mid- and low-ends of the global industrial chain. They are confident in enhancing the global presence of Made-in-China chips.

A total of seven agreements worth a total of 300 million yuan ($47 million) are signed at the opening ceremony of GSOS. [Photo courtesy WeChat account (ID: ZASTO_WX)]