The construction of a production base backed by Nantong Access Semiconductor LLC has recently commenced in Chongchuan district of Nantong, East China's Jiangsu province.

As the first domestic enterprise to start mass producing advanced packaging substrates, Access has made a breakthrough in China's advanced packaging substrates and improved the semiconductor industrial chain in China.

Xu Haiyan, deputy Party secretary of Chongchuan, said during the inauguration ceremony that the second phase project of the facility, which was backed by 2.15 billion yuan ($304.78 million) in investment, is expected to generate an annually added taxable turnover of 1.2 billion yuan after going into full production.

The facility will further optimize the integrated circuit industry structure and help build a new hub for the district's IC industry, Xu noted.

Chen Xianming, general manager of Access, stated at the ceremony that the company will continue to increase investment in developing high-density, high-layer, and ultra-large FCBGA, or flip chip ball grid array, packaging substrate products.

He added that they will leverage their leading technology and resources and seize high-quality development opportunities in the industry to expand their business and inject new vigor into the rapid development of the IC industry in Chongchuan.

The Shibei High-tech Zone, where the construction project is located, will take the opportunity to continue promoting the development of leading enterprises and scientific innovation projects within the zone.

Since the beginning of this year, the zone has started construction on a modern demonstration zone for the IC industry, aiming to build a high-standard IC industrial park in Nantong.

The inauguration ceremony of the project. [Photo/WeChat account: chongchuanonline]

A rendering of the production base. [Photo/WeChat account: chongchuanonline]