A signing ceremony takes place between the Lin-gang Special Area and Chinese consumer electronics giant TCL, on Sept 25. [Photo/WeChat account: shanghaifabu]

The Lin-gang Special Area – situated in East China's Shanghai – held a signing ceremony on Sept 25 for Chinese consumer electronics giant TCL's planned semiconductor AI chip R&D facility which will be located there, according to local media reports.  

TCL is ramping up its efforts in cutting-edge technologies, including artificial intelligence and the internet of things, in a bid to make all its intelligent home appliance products interconnected and satisfy the growing demands of ever-sophisticated consumers.

The project will focus on AI chip designs for intelligent connectivity, perception, AI voice interactions, AI visual interactions and AI image processing. 

Attending the signing ceremony were dignitaries from both sides including Zhu Zhisong, executive deputy director of the Lin-gang Special Area Administration and Li Dongsheng, TCL founder and chairman.