4. Supporting the purchase and development of EDA software. The subsidy amount for purchases of electronic design automation (EDA) software tools, including software updates, by enterprises that actually carry out business operations or R&D in Lin-gang Special Area shall be 50 percent of the actual cost with a maximum of 2 million yuan each year. The R&D subsidy for enterprises that develop IC EDA software tools in Lin-gang Special Area is 50 percent of the R&D cost maximum with the annual maximum subsidy amount of 30 million yuan.

5. Supporting the purchase of IP. The subsidy amount for purchases of IP (from IP providers, EDA providers or original equipment manufacturer IP modules) for high-end chip development shall be 50 percent of the actual payments. The annual subsidy for processes above 45 nanometers is 3 million yuan maximum. The annual subsidy for processes under 45 nanometers is 8 million yuan maximum.

6. Supporting testing and validation. The subsidy amount for units that conduct engineering chip functions, performance, reliability, compatibility, failure analysis or other testing, validation or certification shall be 50 percent of the actual cost with a maximum of 2 million yuan each year.

7. Supporting tape-out by enterprises:

1) The subsidy amount for enterprises that conduct multi-project wafer (MPW) tape-out R&D shall be a certain percent of the direct cost of MPW (100 percent maximum for analog and 60 percent maximum for digital), and the annual maximum subsidy amount is 3 million yuan.

2) The subsidy amount for enterprises that finish full mask (full mask: IP licensing fee, mask base plate cost, testing cost, processing cost) of tape-out of engineering chips for the first time is 50 percent of the tape-out cost maximum. The annual subsidy for processes above 45 nanometers is 6 million yuan maximum and the annual subsidy for processes under 45 nanometers is 20 million yuan maximum.

8. Supporting chip product promotion and application. For  enterprises that sell self-developed or self-designed chips, if the accumulative sales of a single chip product exceed 5 million yuan, the enterprise shall be offered a maximum reward up to 10 percent of the annual sales, with an annual maximum reward for a single chip product of 5 million yuan. For enterprises that sell self-developed and self-produced IC key core equipment or materials, a one-off reward up to 30 percent of the sales will be offered with a maximum amount of 10 million yuan.

9. Supporting electricity consumption for production. For IC packaging, testing, materials and other production enterprises that meet the needs of national strategic development and are recognized by Lin-gang Special Area Administration, a subsidy of 50 percent of the enterprise's electricity costs in the previous year will be offered. The enterprises shall pay their electricity bills first and receive the subsidy afterward. The annual subsidy for each enterprise is 5 million yuan maximum. Each enterprise can receive the subsidy for a maximum of three years.

10. Other supportive measures are also available. IC enterprises (institutions) in Lin-gang Special Area will be included and classified in a database, to carry out precise policy implementation, priority support and combined support according to the actual situation of each enterprise and project. A professional service team will be set up to assist enterprises (institutions) on the database in applying for State-level, Shanghai municipal or Lin-gang Special Area supportive policies for various resources (including improving land use efficiency, etc.), finance and taxation (including income tax, investment and financing, listing incentives, etc.), investment promotion and enterprise introduction (including enterprise settlement, headquarters economy, etc.), human resources (including talent introduction, training, housing (rental) subsidy, medical insurance, children's schooling, other incentives and subsidies, etc.), industrial progress (including breakthroughs in key core technologies and products, industrial capacity improvement, etc.), production-education integration (including industry-university-research cooperation, skilled personnel training, etc.), scientific and technological innovation (including functional platforms, R&D subsidies and incentives, etc.), whole process under bond, cross-border data flow, and subsidies for R&D premises.

This English version is only for reference. To learn more, please refer to the authoritative Chinese version.