WND to build national IC industrial innovation center

National Center for Advanced Packaging [Photo/WeChat account: xinwu_wx]

Wuxi National Hi-tech District will build a national innovation center for integrated circuit (IC) characteristic processing, packaging and testing, according to a decision made April 22.

It will be the first national innovation center built in Jiangsu province to work on new generation information technology (IT) industries. So far, only four such centers have won national approval.

The new national innovation center will be built on the basis of the provincial one, which has built a research and development (R&D) building of more than 10,000 square meters with over 71 upstream and downstream enterprises in the industrial chain and about 300 talents have settled there.

The National Center for Advanced Packaging, a national center for testing and system integration as well as packaging, will lead the construction and work on the research and application of common technologies. The new center is expected to make breakthroughs in the key technology of IC processing, packaging and testing, and even lead global IC development.

At present, the National Manufacturing Innovation Center has been deployed in 36 key construction areas, and 12 units have been approved by the National Manufacturing Innovation Center, of which only four units have been approved in the field of new generation IT.

Gan Yong, an academician of the Chinese Academy of Engineering, believes that the construction of the center will promote the mass production, application and industrialization of high-end packaging technology, and also China's IC industry.